Printed Circuit Board Assembly (PCBA)

Circuit Card Assembly (CCA)

Testing for PCBA

Ball Grid Array (BGA) and Micro BGA

Box Build assembly lines

Box Build testing

Surface-mount technology

Pin-through-hole technology

Multiple configuration capabilities

Prototyping Aqueous clean and no-clean

In-circuit and functional-test development

Flying probe, in-circuit test, functional fest

AOI, hi-pot

Environmental Stress Screening (ESS)

Highly Accelerated Life Testing (HALT)

Highly Accelerated Stress Screening (HASS)

Burn-in

RoHS (Reduction of Hazardous Substances) and Leaded Processes Design for Excellence (DfX)

Depot/logistics/sustainment

Order fulfillment

Full product lifecycle

Ruggedization to include automated/robotic

Flex and rigid flex assembly

Conformal coat

Coating and plastics facility

Machine spray coating and curing

Hand coating and curing

Parylene coating

Lamination

Plastics

Logistics

Build-to-Order (BTO)

Configure-to-Order (CTO)

Built-to-Stock (BTS), Ship-to-Customer

Customer-direct fulfillment

Warehousing and Vendor Managed Inventory (VMI)

High-volume repair center and parts hotline

High-quality repair center

Design and engineering services

Maintenance

Refurbishment and product repair