Sanmina-SCI is dedicated to providing custom backplane and printed circuit board (PCB) solutions that deliver performance and value. Whether you need passive, active or high-bandwidth backplanes, Sanmina-SCI’s combined backpanel fabrication and assembly drives cost-effective solutions ensuring performance and reliability.
Design
With more than 450 dedicated design and NPI engineers, plus 1,500+ technical resources strategically located around the world, Sanmina-SCI produces the best possible designs through:
Project Design & Engineering Management – Design for manufacturability and assembly (DFM/DFA), regulatory agency requirements and NPI initiatives
Electrical Design – ECAD (PCB layout assistance), high-speed engineering, signal integrity with patented technology such as ZBC™ and OptiVia™, selective PTH configurations, active/passive components (SMT/BGA) and press-fit connector systems
Physical Design – Mechanical, signal integrity, power distribution, connector selection and thermal integration
Signal Integrity
Our signal integrity optimized solutions ensure high-speed performance is delivered throughout the interconnect system. Sanmina-SCI’s team of skilled engineers take into account distributed interconnect parameters and subtle EM effects while emphasizing behavior of passive interconnect circuit elements. Effective signal integrity solutions are a fundamental prerequisite in cost-effective manufacturing.
Backplane Fabrication
Speed, flexibility and value. Sanmina-SCI delivers quick-turn, high-mix and high-technology throughout the world.
Our backplane fabrication capabilities include:
Blind and buried vias
PTH signal integrity optimization
Buried Capacitance®
Hybrid construction integrating FR4 and low-loss laminates
Thick-film selectivity located terminating resistors
RoHS-compliant surface finishes
Test
Our specialized test expertise and equipment enables the Sanmina-SCI to meet the most demanding deadlines and satisfy the most challenging customer requirements.
Our backplane test capabilities include:
RoBAT
Flying Probe
Automatic Optical Inspection
X-ray
Testronics
Global Footprint
Our scalable backpanel fabrication and assembly operations serve customers from hundreds of thousands of square feet of manufacturing space in North America, Asia and Europe, with dedicated facilities in San Jose, California, Guadalajara, Mexico, and Kunshan, China. Our manufacturing facilities comply with key regulatory requirements for quality and safety, which include:
ISO 9001:2000
TL 9000
BABT, ETSI, GMP, UL, CSA
Mil-PRF-55110/31032 (Military)
Mil-A-28870 (Military)
Innovation
Innovation is one of the core reasons why customers select Sanmina-SCI backplane products and services. As one of the world’s largest manufacturers of high-technology backplanes, Sanmina-SCI has significant experience designing, manufacturing and testing backplanes.
End-to-End Manufacturing
Sanmina-SCI offers industry-proven manufacturing, supply chain and engineering solutions, having helped thousands of companies increase their
competitive position in a diverse set of end markets. Offering a vertically integrated business model and best-in-class technologies, Sanmina-SCI delivers on quality while lowering landed costs.
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Below are Sanmina-SCI’s key innovations and technology drivers proven to save time, cost and defect rates.
Backplane Solutions & Manufacturing Expertise
Sanmina-SCI’s innovative strategy is a powerful differentiator. With highly skilled design and engineering personnel across our various markets and product segments, we help advance our customers’ technologies and products on a global scale.
For more than 25 years, Sanmina-SCI’s technological know-how has proven to drive down manufacturing costs while solving unique customer requirements. From backplane fabrication and assembly to complex integration and post-manufacturing repair/warranty services, our customers rely on our backplane solutions and expertise to meet their time-to-market and product innovation objectives.
Below are just a few examples of our innovation, expertise and manufacturing capabilities.
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46 Layers
0.304” Thick
16.150” Wide
39.153” Long
GBX High-speed Connector System
24 Layers
0.217” Thick
22.500” Wide
38.500” Long
VHDM Connector System
VHDM HSD Connector System
30 Layers
0.200” Thick
15.250” Wide
16.500” Long
GBX High-speed connector system
30 Layers
0.200” Thick
15.250” Wide
16.500” Long
GBX High-speed Connector System
32 Layers
0.305” Thick
16.500” Wide
20.00” Long
Orthogonal High-speed Connector System
Zpack Max High-speed Connector System
16 Layers
0.156” Thick
6.650” Wide
16.970” Long
Hard Metric 2mm Connector Systems
Micro BGAs
Backplane fabrication and assembly
Complex signal pathways for the entire system
PCB systems cards that plug into the system
Cabinet and cage integration
100% electrical testing
Backplane fabrication and assembly
Complex signal pathways for the entire system
PCB systems cards that plug into the system
Cabinet and cage integration
100% electrical testing
Large Format Backpanel Techology
Attribute
Complexity
Standard
High
Advanced
Layer Count (Max. Layers)
30
60
62+
PCB Size (Max)
21" x 27"
22" x 34"
28" x 42"
Thickness (Max)
0.225"
0.400"
> 0.400"
Materials
FR-4 (Dk>4.2) 2 mil BC®
3.7< Dk< 4.2 1 mil BC®
3.0< Dk< 3.6 1 mil BC®
Inner Layer Line Width/Space
0.005"/0.005"
0.004"/0.004"
0.003"/0.0035"
Outer Layer Line Width/Space
0.006"/0.006"
0.005"/0.005"
0.004"/0.004"
Impedance (SE or DIFF)
10%
7%
5%
Through Hole Aspect Ratio
14:1
17:1
20:1
Drill Registration (no AR)
Drill + 0.010"
Drill + 0.009"
Drill + 0.008"
Blind Vias
Layers n to n-1
Layers n to n-2
>Layers n to n-2
Buried Vias
No
Yes
Yes
Sequential Lamination
No
Yes
Yes
Component Type/Pitch
1.0mm BGA
0.8mm BGA
0.65mm BGA
Local, Regional, Global Manufacturing
Sanmina-SCI is focused on driving operational excellence throughout all of our global facilities. Our solid manufacturing infrastructure and leading-edge capabilities enable us to design, manufacture and deliver electronics products and components into virtually every major marketplace in the world.
Whether a customer needs local, regional or global manufacturing solutions and support, we can help them reduce new market risks with enhanced product quality, decreased time-to-market and improved customer satisfaction.
Our global backplane assembly facilities support regional and lower-cost manufacturing customer requirements.
The Sanmina-SCI San Jose, California, backplane facility
offers a comprehensive suite of backplane services from
NPI, test engineering and DFx, to assembly chassis-level
system integration.
Experience the responsiveness, pricing and quick turnaround times of one of the premier backplane manufacturing facilities in North America. Our Guadalajara, Mexico, backplane facility offers all the services customers require from concept to delivery.
The Sanmina-SCI Kunshan, China, backplane facility specializes in backplane assembly and systems integration providing customers a lower-cost Asian manufacturing solution for high-technology requirements.
Product Complexity – San Jose, Guadalajara and Kunshan Facilities
Complexity level
Form Factor
SMT Placement
Overall Component Placement
High I/O Package
Micro BGA/CSP
High Density SMT Connector
High Density Press-fit Connector
Connector Location
BGA Placement
Active Device Placement
Chip Packages
QFP/TSOP
Type of Soldered Components
Parametric Test
Functional test
Capabilities
Sizes up to 22" X 44" SMT and up to 36" X 48" Press-fit Area
Thicknesses Greater than .500, SMT Tooling Required
Double Sided
BGA >= 500 I/O
Yes
SMT + PTH Mictor >200 I/O
2mm and High Speed Connectors
Back to Back / Common Mode Connection
Double Sided
Double Sided
0402
16 mil Pitch
Wave/Paste One and Two Sided
RF Parametric Test/Calibration
As Required by Customer
Dedicated End Markets
At Sanmina-SCI, we have various backpanel products and solutions to meet the needs of a wide range of industries. Our leadership is dependent on a strategic focus in dedicated end markets. It is with this market-segment approach that we are able to provide more value and customized solutions to each of our customers every day, anywhere around the world.
Offering a vertically integrated business model and best-in-class technologies, Sanmina-SCI delivers on quality while lowering landed costs.
Communications
We specialize in developing and manufacturing
complex assemblies and providing end-to-end,
vertically integrated solutions for use in the
industrial and semiconductor equipment market.
Our expertise includes designing and building
complete systems and sub-systems that meet
the highest levels of performance, quality and
reliability – from front-end wafer handling and
wafer processing to back-end test equipment.
We are the EMS industry leader in the design and
manufacturing of medical devices such as patient
monitors, laser surgery equipment, CT, nuclear
medicine equipment, plus a wide range of other
large, medium and small medical devices. Our
Medical division has FDA registered/QSR
compliant medical facilities in North America,
Europe and Asia.
We design, manufacture and test high-
reliability products and systems in support of
commercial and military aviation, defense
operations and space-flight programs.
We specialize in developing and manufacturing
complex assemblies and providing end-to-end,
vertically integrated solutions for use in the
industrial and semiconductor equipment market.
Our expertise includes designing and building
complete systems and sub-systems that meet
the highest levels of performance, quality and
reliability – from front-end wafer handling and
wafer processing to back-end test equipment.
Sanmina-SCI offers world-class configure-to-order
(CTO) and build-to-order (BTO) capabilities, plus
Joint Design Manufacturing (JDM) solutions within
this industry. Leveraging cutting-edge storage
product development and expertise, a single IT
system, and a fully integrated supply chain
management model, customers experience a
high-level of quality, improved execution and cost
leadership among peers.
We offer a comprehensive suite of design and
engineering resources to meet our customers’
strategic manufacturing goals. We architect
cutting-edge products based on future
technology of integrated system processors.
Our Automotive division supports global
automotive customers as they expand and enter new
markets. We accommodate the unique requirements
of this industry by focusing on zero defect and lean
manufacturing processes.
We’re committed to serving companies leading the
energy revolution in the solar, wind and fuel cell
industries. We understand renewable energy
companies are working tirelessly to lower energy
costs and reduce the impact on the natural
environment. Our goal is to become the
manufacturing partner of choice for companies in
this very important sector.
Backplane Electrical Test
The trend in backpanel manufacturing is to build larger and more dense assemblies. The prospect of fabricating and assembling a backplane should not be pursued without first considering the benefits achievable through Sanmina-SCI’s complete end-to-end manufacturing capabilities – from design and manufacturing to test and delivery. After all, it’s the backplane that provides the complex signal pathways for the entire system.
To ensure industry-leading, high-speed backplane products, the following test capabilities help deliver superior product quality and service to our customers in North America, Europe and Asia.
Equipment
Test Features
RoBAT
Total electrical continuity and short coverage
Electrical testing of components
Very large panel size – 24” x 57”
Simultaneous AOI and electrical test coverage
Low setup cost
Short setup lead time
Eeprom programming*
Hipot testing*
Virtually fixtureless
Full mounting frame design customization and implementation
Testronics
Full net list electrical testing
Electrical testing of components
Large panel size – 30” x 24”
20,480 simultaneous probes
Eeprom programming*
Powered testing*
Probes for connector polarization
Probes for hardware presence
Full test fixture design customization and implementation
Automatic Optical Inspection
Automatic QC vision test
Low setup cost
Short setup lead time
Fast test time
*Special features found only at Sanmina-SCI
Get a Quote Today from Sanmina-SCI
Sanmina-SCI’s worldwide partnerships are diverse and span the entire technology landscape. Companies of all sizes rely on Sanmina-SCI to provide global manufacturing solutions that meet their unique design, assembly and delivery requirements.
For more information on Sanmina-SCI End-to-End Solutions® offerings,
Inquire Here!
Company Information
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